Our metal powder ranges a variety of sizes and shapes. Our metal pastes meet a wide variety of conditions such as Low ~ High temperatures, Nano ~ Micron sizes, Fine ~ Bold lines, Thin ~ Thick film etc.
This page introduces the main metal materials we have and the products they are contained in as a primary material.
Making full use of our years of experience and technologies, we consider various materials and their feature to provide a satisfactory products for our customers.
Line of product materials* *各素材の物性数値の出典：国立天文台編『理科年表』(2013)
Silver
| Chemical sign | Melt point (℃) | Electric resistance (μΩ･cm) | Specific resistance (x10⁻⁶Ω･cm) | Heat expansion coefficient (10⁻⁸/℃) | Features as a metal |
|---|---|---|---|---|---|
| Ag | 961 | 1.6 | 1.59 | 19.1 | Silver is familiar with us as its ornamental use. However, it has the best conductivity among the metals. It is used as various conductive materials for electronic devices since it can be processed aerially. As it is inexpensive among precious metals, it has become one of the primary materials of paste and powder products. |
| Our representative products（e.g.） | Powder、Nano metal particle paste、Thermo setting paste、Sintering paste、Pastes for Film、LTCC、Glass substrates、MLCC、PZT、PTC/NTC thermistor、Varistor、Photovoltaic cell |
|---|
Gold
| Chemical sign | Melt point (℃) | Electric resistance (μΩ･cm) | Specific resistance (x10⁻⁶Ω･cm) | Heat expansion coefficient (10⁻⁸/℃) | Features as a metal |
|---|---|---|---|---|---|
| Au | 1063 | 2.2 | 2.35 | 14.2 | Gold is extremely useful for industrial purpose since it has good corrosion resistance, heat conductivity, electrical conductivity and extensibility. Although generally its use is somehow restricted due to its expensiveness, we have been manufacturing a number of gold powder and paste products, especially metal organics with gold complex, since our establishment. |
| Our representative products（e.g.） | Gold liquid、Powder、Nano metal particle paste、Sintering pastes、Resinate(MO) |
|---|
Copper
| Chemical sign | Melt point (℃) | Electric resistance (μΩ･cm) | Specific resistance (x10⁻⁶Ω･cm) | Heat expansion coefficient (10⁻⁸/℃) | Features as a metal |
|---|---|---|---|---|---|
| Cu | 1084 | 1.7 | '1.67 | 17.2 |
Copper has the second lowest resistance next to silver and is broadly used as a conductive material. The copper pastes need to be sintered in a nitrogen atmosphere. However, it has the advantage that it doesn’t cause ion migration and solder leaching and that it is less expensive than silver while its resistance and sintering temperature are near to those of silver. |
| Our representative products（e.g.） | Nano metal particle paste、The pastes for Inner/outer electrodes、Sinterig pastes |
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Palladium
| Chemical sign | Melt point (℃) | Electric resistance (μΩ･cm) | Specific resistance (x10⁻⁶Ω･cm) | Heat expansion coefficient (10⁻⁸/℃) | Features as a metal |
|---|---|---|---|---|---|
| Pd | 1550 | 10.8 | 10.8 | 11 |
One of the precious metals in the platinum group. As palladium doesn’t deteriorate and doesn’t change its property for long period of time, it is widely used for in-vehicle components and dental materials which require high durability. It also has utility as a compound material such as silver palladium. |
| Our representative products（e.g.） | Powder、Inner electrode paste、Nano metal particle paste、Sintering paste、Resinate(MO) |
|---|
Nickel
| Chemical sign | Melt point (℃) | Electric resistance (μΩ･cm) | Specific resistance (x10⁻⁶Ω･cm) | Heat expansion coefficient (10⁻⁸/℃) | Features as a metal |
|---|---|---|---|---|---|
| Ni | 1452 | 7.2 | 6.84 | 12.8 |
Nickel has a high corrosion resistance and is not only used for plating as an electronic material but also widely recognized as a conductive paste material for inner electrode for MLCC. The development of its use as a conductive material is widening since it is comparatively inexpensive and has good electrical conductivity. |
| Our representative products（e.g.） | Inner electrode paste |
|---|
Platinum
| Chemical sign | Melt point (℃) | Electric resistance (μΩ･cm) | Specific resistance (x10⁻⁶Ω･cm) | Heat expansion coefficient (10⁻⁸/℃) | Features as a metal |
|---|---|---|---|---|---|
| Pt | '1770 | 10.6 | 10.6 | '9 |
Platinum is often used as a catalyst due to its high activity. As it also has a high thermostability, it can also be a material for the components used in high-temperature environments. As our products, we manufacture platinum powders, paste, resinate(MO), etc. |
| Our representative products（e.g.） | Platinum liquid、Powder、Sintering pastes、Resinate(MO) |
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Tungsten
| Chemical sign | Melt point (℃) | Electric resistance (μΩ･cm) | Specific resistance (x10⁻⁶Ω･cm) | Heat expansion coefficient (10⁻⁸/℃) | Features as a metal |
|---|---|---|---|---|---|
| W | 3377 | 5.5 | 5.65 | 4.5 |
As it has a high thermostability due to its high melting spot, tungsten is used for components processed by high sintering temperature. |
| Our representative products（e.g.） | HTCC paste |
|---|
Silver-Palladium
| Chemical sign | Melt point (℃) | Electric resistance (μΩ･cm) | Specific resistance (x10⁻⁶Ω･cm) | Heat expansion coefficient (10⁻⁸/℃) | Features as a metal |
|---|---|---|---|---|---|
| AgPd | - | - | - | - |
Silver-palladium is the material to enable silver to gain the features of palladium such as the resistance of silver to high temperature, ion migration, sulfuration, etc., while saving cost. The feature can be changed by controlling the mix proportion. |
| Our representative products（e.g.） | Powder、Nano metal particle paste、Sintering pastes |
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