
About metal resinate (Organic metal compound)
Metal resinate is also called organic metal compound (including solutions). It is used for a minor component as a metal additive or a material of metal films, alloy films (Au,Pt) and oxide films (Ru, Pd).
We have widely looked on and manufactured the resinate of a platinum group which is especially effective as a catalyst and electrode.
Features
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It generates no corrosive gases on decomposition, so we can prevent alternation of other materials, deterioration of the equipments and environmental pollution.
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It can be homogenously mixed at molecular level with various pastes, and be useful to coat very thin films of nano meter order, applicable to surface activator.
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Low temperature sintering is possible due to the formation of metal with very small size on the thermal decomposition, and a high temperature process is also applicable with the addition of some sintering retardant.
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▲Sintering 850℃ 10min keeping Resistivity 4.3μΩcm

▲Sintering 350℃ 30min keeping Resistivity 11.0μΩcm
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Product
We are offering the solutions of platinum group metal shown in the following table. Solvents and metal concentrations in the table are examples only. They are customizable due to high solubility to organic solvents. Please ask for more details.
| Metal | Metal Concn. (%) | Solvent | Decomp. Temp. (℃) | Application |
| Ru |
6 |
Isobutanol |
200-290 |
RuO2 film, Catalyst |
| Rh |
7 |
Isobutanol |
130-250 |
Additive, Catalyst |
| Pd |
8 |
Butyl acetate |
200-250 |
Pd film, Catalyst |
| Pt |
10 |
Butyl acetate |
140-300 |
Pt film, Catalyst |
| (Au) |
--- |
--- |
160-400 |
Au film |
Following data is of one of Au metal pastes prepared from the resinates above.
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Paste property
| Item No. |
Au-2201Y-10 |
| Metal content |
22% |
| Viscosity |
50Pa・s |
| Solvent |
BC |
| Film hardness |
5H(Pencil Hardness) |
| Firing Temperature |
350℃~850℃ |
| Feature |
Wide range of sintering temperature |
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Application examples
| Paste |
Au-2201Y-10 |
| Screen for printing |
SUS 325 mesh |
| Drying condition |
100℃ 10分 |
| Firing temperature |
750℃ |
600℃ |
350℃ |
| Substrate |
Glazed Alumina Substrate |
Glass Substrate |
Polyimide Film |
| Temperature profile |
Heating time 60min Keeping 10min |
Heating time 50min Keeping 10min |
Heating time 40min Keeping 30min |
| Thickness after firing |
0.2μm |
0.2μm |
0.2μm |
| Surface resistance |
110mΩ/□ |
140mΩ/□ |
270mΩ/□ |
| Resistivity |
2.2×106Ωcm |
2.8×106Ωcm |
5.4×106Ωcm |
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