
Thermo-setting paste / Thermo-plastic paste
Recently, as electronics devices become downsized, weight-saving, and flexible, there are strong requirements to produce electric circuit on such as PET film, PEN film and PI film. In order to satisfy customer`s requests to produce an electric circuit on films of organic materials, our company has developed conductive pastes which has low resistivity and high adhesion even being processed at low temperature and also can make fine line by applying our own polymer blend technology.
- Possible to cure or dry at 120℃ (Recommendation : from 130℃ to 150℃)
CA-6178 also possible to cure or dry in short time, from 5 to 10 min, at temperature of more than 150℃.
- Excellent characteristics in conductivity and adhesion
Especially, CA-6178 makes very low resistivity and CA-6178B makes very high adhesion when curing at 150℃ to 200℃.
- As it’s low temperature process, it can be applied to various organic materials
- Thermo-plastic paste has great adhesion to variety of organic films.
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*The following data are examples. Please ask us if you have other requests.
| Item | CA-6178 | CA-6178B | CA-6178BT | CA-2500E | CA-8590 |
|---|---|---|---|---|---|
| Characteristic | Thermo-setting
Low resistance |
Thermo-setting High adhesion |
Thermo-setting
Good adhesion to ITO |
Thermo-plastic
Good adhesion to variety organic films |
Thermo-setting
Solderable |
| Recommended process | 130℃×30min | 150℃×3.0min | 130℃×30min | 120℃×30min | 200℃×30min |
| Content | 80wt% | 75wt% | 72wt% | 70wt% | 92wt% |
| Viscosity | 195Pa・s | 100Pa・s | 30Pa・s | 50Pa・s | ― |
| Adhesion | 10 N/□ Shear strength is about 1608R | 15 N/□ Shear strength is about 1608R | ― | ― | 1.2N/mm2 Shear strength |
| Resistivity | 28μΩ・cm | 28μΩ・cm | 35μΩ・cm | 30μΩ・cm | 10μΩ・cm |
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Reference: The graph shows relevance between curing time and conductivity of our CA-6178 type. When curing at higher temperature and for a longer period, resistivity declines and obtains better conductivity. It’s possible to have resistivity of 20μΩ・cm when curing at 180℃. |
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| Photograph of gold plated thermo-setting electrode |
SEM photograph of cross section of solder and thermo-setting electrode |
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| Photograph of substrate with soldered thermo-setting electrode ; PI film |
CA-2503 series
CA-2503-4 is a silver paste which could obtain low resistivity of less than 10μΩ・cm with the application of a combined technology with our own-made silver nano-particles. In addition, we have enhanced its printability for fine line and its cohesion to a polyimide film, therefore, it’s a suitable paste for designing an advanced pattern to flexible circuit boards.
- Possible to make printing pattern finer than 30μm
- Possible to apply on films like Polyimide
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| {CA-2503-4} 30μm Patterning Polyimide film 200℃-30min |
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*The following data are examples. Please ask us if you have other requests.
|
CA-2503N | CA-2503-4 | CA-2503-4B |
|---|---|---|---|
| Curing condition | 200℃-30min | 200℃-30min | 200℃-30min |
| Filler | Ag powder | Ag powder + Nano Ag | Ag powder + Nano Ag |
| Ag Content | 85wt% | 80wt% | 80wt% |
| Viscosity | 160~200Pa・s | 160~200Pa・s | 300~350Pa・s |
| Resistivity | 30μΩ・cm | 10μΩ・cm | 25μΩ・cm |
| Fine line | Possible to print 30μm line | Possible to print 30μm line | Possible to print 15μm line |
| Characteristic | Good adhesion with Polyimide film | Low resistivity Good adhesion with Polyimide film |
Good to print fine line |
| Remarks | No content of Nano Ag | Standard product | High viscosity and high thixotrophy |
Test condition :
Viscosity : Brookfield HBT type Spindle No. 14 10rpm 25±1℃
Resistivity : Comb pattern 1mm×500mm