Intended use
| Mount field | Organic materials, glass and ceramic substrate |
|---|---|
| Device forming | LTCC patterning, LTCC VIA, Solar cell, Multilayer chip devices, Thermistor, Sensor, Inductor, Varistor, HTCC etc |
Product list by use/application
Paste for Organic films/substrates
|
Silver conductive paste for films like PET etc. and rigid substrate. |
Pattern photograph |
| Item. No | Category | Resin type | Resistivity | Temperature | Example use | Feature |
|---|---|---|---|---|---|---|
| CA-T31 |
Low temp. Fine line |
Polyether | 1.8×10⁻⁵ | 130℃×30min | Circuit patterning･Print | Drying type |
Paste for LTCC use
Silver, Silver-Platinum conductive paste, corresponding to various sintering temperature and shrinkage rate of substrates, and various sintering method.
| Product No. | Filler | Resistance | Application | Temperature | Feature |
|---|---|---|---|---|---|
| PA-88 | Ag | 2.0μΩ・㎝ | Screen print | 900℃ | LTCC Fine-line printable |
| TCR-880 | Ag | 1.9μΩ | Screen print | 900℃ | LTCC Fine-line printable |
Tailor-made specification is available for adjusting viscosity, content, filler, size of the particles and other features and also considering the use such as inner/outer electrode, via, the substrate, sintering condition and print methods.
More details for sintering pastes for LTCC (LTCC paste page)
Paste for Glass substrates
|
This silver paste forms dense membrane, shows low |
|
| Product No. | Filler | Resistance | Application | Temperature | Feature |
|---|---|---|---|---|---|
| UA-202A | Ag | 3.0μΩ・㎝ | Screen print | 480～550℃ | Good adhesion to glass |
Paste for MLCC
|
Inner electrode paste for chip capacitor from general model to high cap model. |
|
Inner electrode
| Ni particle size | Application | Temperature | Electrode thickness (After firing) | Intended use |
|---|---|---|---|---|
| 0.6μm | Screen print | >1300℃ | >1.5μm | 1608-103, 2012-226, 3216-476 |
| 0.4μm | Screen print | 1250~1300℃ | 1.0~1.5μm | 1608-105, 2021-476, 3216-106 |
| 0.3μm | Screen print | 1200~1250℃ | <1.2μm | 1005-105, 1608-225, 2012-106, 3216-226 |
| 0.2μm | Screen print | 1200~1250℃ | <1.0μm | 0603-105, 1005-225, 1608-106, 2012-476 |
| 0.15μm | Screen print | <1200℃ | <0.6μm | 0603-105, 1005-475 |
Outer electrode
| Product No. | Filler | Application method | Sintering condition | Content | Chip size |
|---|---|---|---|---|---|
| TCU-101G | Cu | Dipping | Post firing 850℃ | 80～82% | 1608～2125 |
| TCU-106R | Cu | Dipping | Post firing 850℃ | 72～80% | 1608～3216 |
| AG-100 | Ag | Dipping | 720-760℃ | 78% | 1005～3216 |
| AG-101 | Ag | Dipping | 720-760℃ | 75% | 1005～3216 |
Pd paste and AgPd paste for inner/outer electrodes are also available.
Tailor-made specification is available for adjusting content, film thickness, chip size and so on. More details
Paste for HTCC
Pastes used for the inner layer and outer layer electrode for HTCC.
| Product No. | Application | Filler | Remarks | Particle size |
|---|---|---|---|---|
| W-04 | Screen print | Tungsten | For heater etc. | 1.6μm |
| W-18 | Screen print | Tungsten | High dispersibility | 1.1μm |
| W-29 | Screen print | Tungsten | ― | 2.2μm |
Tailor-made specification is available for content, filler, dispersibility and so on.
Paste for Piezoelectric devices
Pastes for the inner electrodes such as PZT, Relaxor and so on.
| Item. No | Filler | Application method | Temperature | Use | Particle size |
|---|---|---|---|---|---|
| GDA-270 | AgPd7030 | Screen print | 1120℃ | Inner electrodes | 0.6μm |
| GDA280 | AgPd8020 | Screen print | 1020℃ | Inner electrodes | 0.6μm |
| GDA-290 | AgPd9010 | Screen print | 950℃ | Inner electrodes | 0.6μm |
Tailor-made specification is available for content, filler, distersibility and so on.
Paste for PTC/NTC thermistor
|
Our PTC thermistor paste is excellent silver conductive paste for ohmic use. |
Outer electrode for PTC thermistor |
| Product No. | Content | Filler | Use | Sintering temp. | Thermistor |
|---|---|---|---|---|---|
| TH-45 | 76 | Ag/Zn | Screen printing | 480-700 |
PTC thermistor / ohmic |
| TH-631 | 70 | Ag | Screen printing | 480-700 |
PTC thermistor / ohmic |
| AD-400 | 82 | Ag/Pd=7/3 | Dip | 850-900 | NTC thermistor |
| AD-401 | 72 | Ag/Pd=7/3 | Dip | 850-900 |
NTC thermistor |
Specification for transfer printing is also available. Considering the content or other features,
Paste for Varistor
| Product No. | Filler | Application | Sintering temp. | Feature |
|---|---|---|---|---|
| Pd-600 | Pd | Screen print | 1250℃ | Varistor, Inner electrodes |
| Ag-800 | Ag | Screen print | 900℃ | Varistor, Inner electrodes |
for outer electrode of Varistor
| Product No. | Content | Filler | use | Sintering temp. | Plating |
|---|---|---|---|---|---|
| AG-300 | 75 | Ag | Dip | 640-680 | ○ |
| AG-301 | 84 | Ag | Printing | 650-750 | ○ |
Specification for transfer printing is also available. Considering the content or other features,
Pastes for Resonater
|
Pastes optimal for metalizing the surface of resonater. |
|
| Product No. | Filler | Resistance | Application | Sintering temp. | Use |
|---|---|---|---|---|---|
| HS-118K | Ag | 3.0μΩ・㎝ | Dipping | 850℃ | Resonater Outer electrode |
| HS-118KS | Ag | 3.0μΩ・㎝ | Dipping | 850℃ | Resonater Outer electrode |
For details, please refer to the link here. → Gifu Plant
RuO₂ Resistance Paste
|
Resistance paste of RuO₂. Adjustable in the specification below depending on your sheet, sintering condition etc. |
|
| Item | Standard (e.g.) | Measuring condition |
|---|---|---|
| Resistance |
10Ω ± 10% 100Ω ± 10% 1kΩ ± 10% 10kΩ ± 10% 100kΩ ± 10% |
1 mm□ × 20 μm, |
| H-TCR(resistance rate of change/℃) | ± 100 ppm/℃ |
Ambient temperature + approx. 150 ℃ |
| Viscosity | 220 ± 50 Pa･s |
BF, Spidle No.14, 10rpm, 25℃ |
| Residue on ignition | 52 ± 5% | 850℃ 10min of sintering |
Paste for Inductor
Pastes for inner/outer electrodes of inductor.
For Outer electrodes of Inductor
|
|
AG-200 |
 |
AG-200 |
| Product No. | Content | Filler | Application | Sintering temp. | Plating |
|---|---|---|---|---|---|
| AG-200 | 70 | Ag | dip | 640-680 | ○ |
| AG-201 | 70 | Ag | dip | 720-760 | ○ |
Speculation for transfer printing is also available.
For Inner electrode of Inductor
|
|
AG-500 30μm line |
| Product No. | Content | Filler | Application | Sintering | Line width | Use |
|---|---|---|---|---|---|---|
| AG-500 | 85 | Ag | 印刷 | 800-900 | 30-50μm | Fine line |
| AG-501 | 87 | Ag | 印刷 | 800-900 | 50≦ | Standard |
Metal Organic Compound (Resinate)
|
We have widely looked on and manufactured the resinate of a platinum group which is especially effective as a catalyst and electrode. |
|
| Product No. | Filler | Specific resistance | Application | Sintering temp. | Use |
|---|---|---|---|---|---|
| Au resinate | Au | 3μΩ・㎝ | Screen print | 600℃～800℃ | Thermal head |
| Pt resinate | Pt | 70μΩ・㎝ | Screen print・DIP | 400～800℃ | Sensor |
| Pd resinate | Pd | ― | Screen print・DIP | 300～800℃ | Activation cover coating |
| Ru resinate | Ru | ― | Screen print・DIP | 300～800℃ | RuO2 Resistance over |
| Iｒresinate | Ir | ― | Screen print・DIP | 250℃以上 | Addition agent |
