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Product information
- Thermo-setting and thermo-plastic use
- Conductive metal paste for firing process
- Metal powder
Research & Development
Other products
New Product: Iridium Resinate
Our corporation have prepared platinum group resinates by using non-halogen starting materials, offering their solutions and metal pastes based on them. Iridium resinate virtually free from Chlorine (containing less than 0.1% of residual chlorine to Iridium atom) has developed recently. This resinate is easy to form into the paste because it is well soluble in various organic solvents and compatible with various polymers. The resinate is also usable as an additive of iridium metal. Iridium metal is expected to become a good additive for improving heat resistance of metal films due to the characteristics of small solubility to metallic Gold and Silver.
Iridium Acetate, which is soluble in water and stable in the air, is also available.
About metal resinate (Organic metal compound)Metal resinate is also called organic metal compound (including solutions). It is used for a minor component as a metal additive or a material of metal films, alloy films (Au,Pt) and oxide films (Ru, Pd).
We have widely looked on and manufactured the resinate of a platinum group which is especially effective as a catalyst and electrode.
- Halogen and Sulfur Free
It generates no corrosive gases on decomposition,
so we can prevent alternation of other materials,
deterioration of the equipments and
environmental pollution.
- Useful as a minor component
Additive or for very thin film coating
(for Surface activator etc.)
It can be homogenously mixed at molecular
level with various pastes, and be useful to
coat very thin films of nano meter order,
applicable to surface activator.
- Wide range of firing
temperature conditions
Low temperature sintering is possible due to the
formation of metal with very small size on the
thermal decomposition, and a high temperature
process is also applicable with the addition of
some sintering retardant.
Sintering 850℃ 10min keeping
Resistivity 4.3μΩcm
Sintering 350℃ 30min keeping
Resistivity 11.0μΩcm
We are offering the solutions of platinum group metal shown in the following table. Solvents and metal concentrations in the table are examples only. They are customizable due to high solubility to organic solvents. Please ask for more details.
| Metal | Metal Concn. (%) | Solvent | Decomp. Temp. (℃) | Application |
|---|---|---|---|---|
| Ru | 6 | Isobutanol | 200-290 | RuO2 film, Catalyst |
| Rh | 5 | Isobutanol | 130-250 | Additive, Catalyst |
| Pd | 8 | Butyl acetate | 200-250 | Pd film, Catalyst |
| Ir | 8 | Isobutanol | 200-250 | Additive, Catalyst |
| Pt | 10 | Butyl acetate | 140-300 | Pt film, Catalyst |
| (Au) | --- | --- | 160-400 | Au film |
Following data is of one of Au metal pastes prepared from the resinates above.
Paste property
| Item No. | Au-2201Y-10 |
|---|---|
| Metal content | 22% |
| Viscosity | 50Pa・s |
| Solvent | BC |
| Film hardness | 5H(Pencil Hardness) |
| Firing Temperature | 350℃~850℃ |
| Feature | Wide range of sintering temperature |
Application examples
| Paste | Au-2201Y-10 | ||
|---|---|---|---|
| Screen for printing | SUS 325 mesh | ||
| Drying condition | 100℃ 10min | ||
| Firing temperature | 750℃ | 600℃ | 350℃ |
| Substrate | Glazed Alumina Substrate | Glass Substrate | Polyimide Film |
| Temperature profile | Warm-up time 60min Keeping 10min | Warm-up time 50min Keeping 10min | Warm-up time 40min Keeping 30min |
| Thickness after firing | 0.2μm | 0.2μm | 0.2μm |
| Surface resistance | 110mΩ/□ | 140mΩ/□ | 270mΩ/□ |
| Resistivity | 2.2×10--6Ωcm | 2.8×10--6Ωcm | 5.4×10--6Ωcm |
We are also offering concentrated aqueous solutions of dielectric materials such as titanium oxide, used for manufacturing powders and films of TiO2, BaTiO3, PbTiO3, (Ba,Pb)TiO3. Additionally Ba(Ti,Zr)O3, Pb(Ti,Zr)O3, (BaPb)(Ti,Zr)O3 etc. also can be formed by concomitant use of commercially available zirconium oxide aqueous solution.
| Item No. | Component | Applying method | Temperature | Application / Feature |
|---|---|---|---|---|
| DTL-20MS (Acid) | TiO2 | Spin coat | 600℃ | Dielectric film, Photocatalyst |
| T-TMA (Basic) | TiO2 | Spin coat | 600℃ | Dielectric film, Photocatalyst |
| TLB-30 | BaTiO3 | Spin coat | 800℃ | Dielectric film and powder |
| TLBS-30 | BaxSryTiO3 | Spin coat | 800℃ | Dielectric film and powder |
Ask us for other metal resinates and any questions.
Contact our Sales Department for details.
Tel: +81-6-6961-6533
Email:
Tel: +81-6-6961-6533
Email:
