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We have elaborated powders and paste manufacturing processes to meet respective purposes.
Metal:Silver, Gold, Platinum, Palladium, Copper,
Aluminum, Tungsten, Carbon, Ruthenium,
Rhodium
Application:LTCC, Solar cell, Resonator, capacitor,
Inductor, Antenna, Piezoelectric,
Thermistor, Varistor, Sensor, etc
Shrinkage control, fine-line printability. Our paste is developed to cater to one`s requirements.
Metal:Silver, Silver-Platinum, Silver-Palladium
Good conductivity with firing at 430℃~580℃. Excellent to form circuit on glass substrate.
Metal:Silver
Ni conductive paste for MLCC inner layers. You can create high cap chip with our latest product enabling making thin layers less than 1 micron meter.
Metal:Nickel
For a future micro technology, we have studied and developed nano metal particles.
Organic metal compound which forms homogeneous solution. We have succeeded to develop Iridium resinate.
Our powders bring out paste's character at most.
Metal:Silver, Silver-Palladium, Gold, Palladium,
Platinum