
Outline
This silver paste forms dense membrane, shows low resistivity and obtains good adhesion to glass substrate by firing at from 430℃ to 600℃.
~Difference from the Ag pastes for ceramics~
Silver paste for ceramic normally starts sintering around 500℃ and even LTCC needs its top temperature between 800℃ to 900℃ for sintering. But the silver paste for low temperature firing is designed to start sintering nearly 350℃ and culminate around 400℃. Besides the paste shows good adhesiveness to glass substrates by sintering around 430℃.
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Features
It contains glass frit which is lead free. It can be fired at low temperature, 480 degree Celsius. It has low resistance value, 3.0μ Ω・cm. It has good bonding strength to glass substrate.
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Products
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UA-302 |
US-201 |
Metal content |
78~85wt% |
78~85wt% |
Viscosity |
180~250Pa・s |
180~250Pa・s |
Temperature |
480℃~550℃ |
430℃~500℃ |
Resistivity |
3.0~2.0μΩcm |
3.0~2.0μΩcm |
*The following data are examples. Please ask us if you have other request.
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Paste appearance
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Printed paste on glass substrate
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UA-302480℃-30min |
US-201430℃-30min |
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SEM appearance×2000 |
SEM appearance×2000 |

Outline
We have developed and manufactured conductive paste for car and communication devices. Nowadays all devices have become smaller and smaller so the electrodes have become finer or thinner.
Very little difference in electrode materials often produce variable results from very little difference. We handle them with flexibility and knowledge and technique.

What is LTCC ?
LTCC is the abbreviation for Low Temperature Co-fired Ceramics. It is made by mixing alumina and glass compound to form a green sheet. LTCC enables sintering at temperature as low as or less than 1000℃ so that Ag or Cu can be adopted as the conductor, making co-fire possible after laminating the conductor and green sheets, it also miniatures devices by low resistance and high density of substrates so that LTCC beckons to be used for high frequency devices.
Features
1.Fine lines by screen-printing

It makes no open circuit or short circuit when screen-printing in L/S=20/20, 30/30, 40/40.
2.Shrinkage behavior control

Shrinkage behavior becomes under control by adding additives and our paste shows good match with a variety of green sheets.
3.High Hear-Resistance(with Fine-Line printability)
TMA (Thermal Mechanical Analysis) result of silver paste (No additives). It starts shrinking at higher temperature and still keeps fine-line printability.

Outline
Nickel paste for MLCC inner electrode
A requirement for thinner MLCC`s inner electrode has been increasing as MLCC has recently been more and more miniaturized and obtained higher capacity. DAIKEN has manufactured nickel paste for MLCC for years. We have now commercial production of new nickel paste which is developed for the thinner electrode, with having them under consideration such as selection of particle size with removal of coarse grinds and also percolation of solvent to the dielectric sheets. We offer it with customization in order to suit your conditions(printing, laminating, sintering), as only one and number one product to our respective customer.
What is MLCC?
Multilayer ceramic capacitor is made of the structure in which a number of dielectric layers and electrode layers are connected in parallel are stacked.
MLCC is small, obtains a large capacity and is excellent in the high-frequency characteristics. Therefore, it has become an important passive components that are essential for electronic equipment.
The electronic equipments in which it is used are mainly, a mobile phone, personal computer, digital camera, is for the digital electronic components and automotive parts such as a flat-screen TV.

Cross-sectional view of Multi-layer Ceramic Capasitor
MLCC inner electrode paste
Our newly developed BaTiO_3 (Patent No. 5519417) has enabled Ni Internal Electrode Paste to form thin-layer electrode.
Feature

Our Conventional paste product and Development paste product
Ni Paste | Solid Content | Ni Content | Screen Mesh | Lay Down (mg/cm2) |
Conventional paste |
40.51% |
36.5% |
SUS#500CL |
0.300 |
Developent paste |
40.55% |
36.5% |
SUS#500CL |
0.307 |

(A):Our Conventional product (B):Our Development product
Product Lineup
Inner electrode paste for MLCC
Ni particle
size
| Application |
Sintering
Temp.
| Goal Thickness (After fireing) | Example of MLCC applications |
0.6μm |
Screen Printing |
1300℃以上 |
1.5μm以上 |
1608-103、2012-104 |
0.4μm |
Screen Printing |
1250~1300℃ |
1.0~1.5μm |
1608-105、2012-475、3216-106 |
0.3μm |
Screen Printing |
1200~1250℃ |
1.2μm以下 |
1005-105、1608-225、2012-106、 |
0.2μm |
Screen Printing |
1200~1250℃ |
1.0μm以下 |
0603-104、1005-225、1608-106、 |
0.15μm |
Screen Printing |
1200℃以下 |
0.6μm以下 |
0603-105、1005-476 |
MLCC outer electrode paste.
This is a Cu paste developed for external electrode such as chip parts.
(Please contact us for applicable chip sizes.)
Over conventional Cu paste, it has the following advantages because it can form electrodes with high coverage.
Feature

Description
Item | Reference Value |
Inorganic Content |
81±3wt% |
Viscosity |
42±5Pa・s |
Solvent |
Terpineol |
Sintering Temp. |
850℃ |
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Appearance Photograph
Chip size: 1608
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SEM photo of sintered film
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Evaluated characteristics

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Since it can form a dence film, it gives stable electrode strength with less variation when soldered.
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This paste is for firing around over 1500℃ which is higher than the firing temperature for LTCC. It is often used for the package of censors, LED, ceramic heaters, and optical transmission system and so on.
Paste for HTCC
We have products for general-purpose chip capacitor and high-volume. We can also develop pastes to meet the requirement of our customers.
Product No. | Printing | Filler | Remarks | Powder grain size |
W-04 |
Screen |
Tungsten |
Heater |
1.6 |
W-18 |
Screen |
Tungsten |
High Dispersibility |
1.1 |
W-29 |
Screen |
Tungsten |
― |
2.2 |
Content, filler, dispersibility etc. are adjustable.