Outline
This silver paste forms dense membrane, shows low resistivity and obtains good adhesion to glass substrate by firing from 430℃ to 600℃.
～Difference from the Ag pastes for ceramics～
Silver paste for ceramic normally starts sintering around 500℃ and even LTCC needs its top temperature between 800℃ to 900℃ for sintering. But the silver paste for low temperature firing is designed to start sintering nearly 350℃ and culminate around 400℃. Besides the paste shows good adhesiveness to glass substrates by sintering around 430℃.
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FeaturesIt contains glass frit which is lead free. |
Products
*The following data are examples. Please ask us if you have other requests.
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Paste appearance |
Printed paste on glass substrate |
| 480℃-30min | 430℃-30min |
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| SEM appearance×2000 | SEM appearance×2000 |
Outline
We have developed and manufactured conductive paste for car and communication devices. Nowadays all devices have become smaller and smaller so the electrodes have become finer or thinner.
Very little difference in electrode materials often produce variable results from very little difference. We handle them with flexibility and knowledge and technique.
Features
1.Fine lines by screen-printing
It makes no open circuit or short circuit when screen-printing in L/S=20/20, 30/30, 40/40.
2.Shrinkage behavior control
Shrinkage behavior becomes under control by adding additives and our paste shows good match with a variety of green sheets.
3.High Hear-Resistance(with Fine-Line printability)
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TMA (Thermal Mechanical Analysis) result of silver paste (No additives). It starts shrinking at higher temperature and still keeps fine-line printability.
Outline
Nickel paste for MLCC inner electrode
A requirement for thinner MLCC`s inner electrode has been increasing as MLCC has recently been more and more miniaturized and obtained higher capacity. DAIKEN has manufactured nickel paste for MLCC for years. We have now commercial production of a new nickel paste which is developed for the thinner electrodes, using newly developed dielectric ceramic fine particles as a common material. We offer it with customization in order to suit your conditions(printing, laminating, sintering), as only one and number one product to our respective customer.
What is MLCC？
Multilayer ceramic capacitor is made of the structure in which a number of dielectric layers and electrode layers connected in parallel are stacked.
MLCC is small, obtains a large capacity and is excellent in the high-frequency characteristics. Therefore, it has become an important passive component that is essential for electronic equipments.
The electronic equipments in which it is used are mainly mobile phones, personal computers, digital cameras, flat-screen TVs and automotive parts.
Cross-sectional view of Multi-layer Ceramic Capasitor
MLCC inner electrode paste
Feature
Our Conventional paste product and Development paste product
| Ｎｉ Paste | Solid Content | Ni Content | Screen Mesh | Lay Down (mg/cm2) |
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| Conventional paste | 40.51% | 36.5% | SUS#500CL | 0.300 |
| Developent paste | 40.55% | 36.5% | SUS#500CL | 0.307 |
（A）：Our Conventional product （B）：Our Development product
Introduction of the books
The books in which our engineer's untold story of the development is included. (written in Japanese)
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| シーエムシー出版 | 日刊工業新聞社 | 技術情報協会 | 森北出版 |
MLCC outer electrode paste.
This is a Cu paste developed for external electrode such as chip parts.
（Please contact us for applicable chip sizes.）
Over conventional Cu paste, it has the following advantages because it can form electrodes with high coverage.
Feature
Description
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Appearance Photograph Chip size: 1608 |
SEM photo of sintered film |
Evaluated characteristics
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Since it can form a dence film, it gives stable electrode strength with less variation when soldered. |
This paste is for firing around 1500℃ which is higher than the firing temperature for LTCC. It is often used for the package of censors, LED, ceramic heaters, and optical transmission systems and so on.
Paste for HTCC
We have products for general-purpose chip capacitors and high-volume. We can also develop pastes to meet the requirement of our customers.
| Product No. | Printing | Filler | Remarks | Powder grain size |
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| W-04 | Screen | Tungsten | Heater | 1.6 |
| W-18 | Screen | Tungsten | High Dispersibility | 1.1 |
| W-29 | Screen | Tungsten | ― | 2.2 |
Content, filler, dispersibility etc. are adjustable.
